nemu

Thick Film Solutions

Ultra Thick film Printed Cu substrate（TPC）

  • Ultra Thick film Printed Cu substrate（TPC）サムネイル1
  • Ultra Thick film Printed Cu substrate（TPC）サムネイル1

Copper films can be easily laminated using screen printing. By optimizing the printing process, it is also possible to create steps.
It has equivalent reliability to the AMB substrate.

Contact us about this product

Product Details

Features

    • Max. film thickness: 0.8mmt, Min. pattern spacing: 0.3mm
    • It can be used with silicon nitride, aluminum nitride, sapphire, alumina, etc.
    • It has equivalent reliability to the AMB substrate.

Structure

  • Structure
    Structure

    (1) Substrate
    (2) Active metal bonding layer
    (3) Copper layer

  • Cross-sectional SEM image
    Cross-sectional SEM image

    Copper paste ultra-thick film (300μm) fired substrate bonding surface using active metal paste.
    (1) Bonding layer
    (2) Copper film
    (3) AlN substrate

Application Example

  • Ceramic heat-dissipating circuit packages for power devices

Specification

Item Reference standard Remarks
Base material Material AlN, Al₂O₃, SiN Please contact us for other materials.
Size 50~114mm□ -
Thickness 0.2mm～ -
Conductor properties L/S ≧200／200μ -
Film thickness 100~500μ For 500µm or more, please contact us.
Resistivity 2.5~4.0μΩ㎝ -
Adhesion before plating ≧3.0kgf/2mm□ Measured by peel test
Adhesion after plating ≧2.5kgf/2mm□
Durability after plating Al₂O₃: Thermal shock test, Endurance over 2,000 cycles 1cycle：-45°C(30min)⇔120°C(30min)
AlN: Thermal shock test, Endurance over 1,500 cycles 1cycle：-45°C(30min)⇔120°C(30min)
SiN: Thermal shock test, Endurance over 3,000 cycles 1cycle：-45°C(30min)⇔150°C(30min)